发明名称 |
LIGHT-EMITTING CHIP DEVICE WITH HIGH THERMAL CONDUCTIVITY |
摘要 |
This invention provides a light-emitting chip device with high thermal conductivity, which includes an epitaxial chip, an electrode disposed on a top surface of the epitaxial chip and a U-shaped electrode base cooperating with the electrode to provide electric energy to the epitaxial chip for generating light by electric-optical effect. The epitaxial chip includes a substrate and an epitaxial-layer structure with a roughening top surface and a roughening bottom surface for improving light extracted out of the epitaxial chip. A thermal conductive transparent reflective layer is formed between the substrate and the epitaxial-layer structure. The electrode base surrounds the substrate, the transparent reflective layer and a first cladding layer of the epitaxial-layer structure to facilitate the dissipation of the internal waste heat generated when the epitaxial chip emitting light. A method for manufacturing the chip device of the present invention is provided.
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申请公布号 |
US2009078952(A1) |
申请公布日期 |
2009.03.26 |
申请号 |
US20080047165 |
申请日期 |
2008.03.12 |
申请人 |
HORNG RAY-HUA;WUU DONG-SING;HUANG SHAO-HUA;HSIEH CHUANG-YU;LIN CHAO-KUN |
发明人 |
HORNG RAY-HUA;WUU DONG-SING;HUANG SHAO-HUA;HSIEH CHUANG-YU;LIN CHAO-KUN |
分类号 |
H01L33/00;H01L33/22;H01L33/46 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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