| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device such that substrates are prevented from shifting in position when the substrates mounted with devices of an upper layer and a lower layer are joined together with solder balls. <P>SOLUTION: The semiconductor device is mounted with a plurality of devices and has a substrate mounted with the plurality of devices on its top surface side and provided with a plurality of solder balls 3 on its backside. A projection portion 12 is provided on the backside of the substrate to prevent the substrate from shifting in position from the lower-layer substrate by coming into contact with portions of the devices mounted on the top surface side of a lower-layer substrate stacked on the lower-layer side of the substrate. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
