| 摘要 |
To be provided is an appearance inspection method of acquiring an accurate data regarding a chipping of a semiconductor chip generated by a dicing step. It includes: acquiring the image data of the semiconductor chip; binary-processing the image data; recognizing a chipping end 23 provided in the semiconductor chip from the binary-processed image data; setting a reference line 17 in an element formation region side of the semiconductor chip from the chipping end; and measuring a distance from the reference line 17 to the chipping end 23 are provided.
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