ELECTRONIC SYSTEM, AND METHOD FOR MANUFACTURING A THREE-DIMENSIONAL ELECTRONIC SYSTEM

摘要

A method for manufacturing a three-dimensional electronic system comprises: provision of a first integrated circuit structure in a first substrate (110), wherein the first integrated circuit structure has a contact face (150) on a first main side (117) of the first substrate (110); provision of a second substrate (210) having a main side (215); formation of a vertical contact region (240) in the second substrate (210). Next, the method comprises formation of a semiconductor layer (212) on the main side (215) of the second substrate (210); formation of a semiconductor component of a second integrated circuit structure in the second substrate (210) with the semiconductor layer (212); removal of substrate material from a side (217) of the second substrate (210) that is opposite the main side (215), so that the vertical contact region (240) is electrically exposed on the opposite side (217); arrangement of the first and second substrates (110, 210) on one another so as to orient the vertical contact region (240) to the contact face (150), so that electrical connection is set up between the first and second integrated circuit structures via the vertical contact region (240) and the contact face (150).