| 摘要 |
A printed circuit board for the stud bump bonding and manufacturing method thereof is provided to simplify the manufacturing process of a printed circuit board by performing a surface process and a free solder process at the same time. A printed circuit board for stud bump bonding comprises a bonding pad(101). The bonding pad mounts semiconductor. The bonding pad comprises a conductive metal layer and electroless tin plating layer(103) or a electroless tin alloy plating layer. The electroless tin plating layer or the electroless tin alloy plating layer is formed on the conductive metal layer. The electroless tin plating layer and electroless tin alloy plating layer are respectively a electroless tin displacement plating layer and electroless tin alloy displacement plating layer. |
