| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper circuit board which can reduce unnecessary electrostatic stray capacitance to be added to a semiconductor power module caused by the copper circuit board, and to provide a semiconductor module device. SOLUTION: A semiconductor element 21 is mounted on a first conductive layer 13 on the copper circuit board 11 stuck on a heat-dissipating plate 17 in an electrically insulated state, and an electrode pad of the semiconductor element 21 and a conductor island (second conductor layer 14 and third conductive layer 15) for external electrode terminal connection, provided on the copper circuit board 11 while being isolated from a semiconductor element mounting region are connected by lead wires 25 and 26, surface regions of the second conductive layer 14 and third conductive layer 15 that form the conductor island being non-capacitor regions with the generation of stray capacitance is reduced, as much as possible. COPYRIGHT: (C)2009,JPO&INPIT |
