| 摘要 |
PROBLEM TO BE SOLVED: To provide a system and a method for automatically attaching a preform to a substrate, wherein it is ensured that the preform is both secure and flat and has minimal stress when being tacked to a leadless chip carrier. SOLUTION: The system includes a preform nest 34, a first component 32 that places the substrate into the nest, a second component 24 that places the preform on the substrate in the nest, a tacking device that tacks the preform to the substrate, a plurality of sensors that sense operational states of the components and the tacking device, and a controller that automatically controls operations of the components and the tacking device based on the sensed operational states. COPYRIGHT: (C)2009,JPO&INPIT
|
