OBSERVATION DEVICE AND OBSERVATION METHOD

摘要

PROBLEM TO BE SOLVED: To provide an observation device capable of rapidly recognizing the outline and flaw of a wafer 10. SOLUTION: This observation device is equipped with an imaging part capable of partially imaging the wafer 10 and constituted so as to observe the surface of the wafer 10 using the partial image C of the wafer 10 in a plurality of imaging regions obtained by imaging a plurality of the parts of the wafer 10 (apex part 13) while relatively moving the imaging regions of the imaging part in a circumferential direction of the wafer 10. This observation device has an image connection part for relatively mutually connecting a plurality of the partial images C of the wafer 10 imaged by the imaging part so as to arrange them in a relative moving direction after subjecting the partial images C to data compression processing without changing the imaging regions to form a connected image B capable of continuously visually confirming the apex part 13 of the wafer 10 in the circumferential direction and an image display part for displaying the connected image B connected by the image connection part. COPYRIGHT: (C)2009,JPO&INPIT