A LEADFRAME STRUCTURE FOR ELECTRONIC PACKAGES

摘要

A leadframe structure (100) for an electronic package is provided, wherein the leadframe structure (100) comprises a die-pad (103), a barrier area (114), and a bonding area (111), wherein the barrier area (114) is arranged between the die-pad (103) and the bonding area (111), and wherein the barrier area (111) is adapted to electrically connect the die-pad (103) and the bonding area (111), and is further constructed in such a way that delamination growth between the leadframe structure (100) and a moulding compound fixable to the leadframe structure (100) is reduced.