PICK AND PLACE SYSTEM FOR A SEMICONDUCTOR ASSEMBLY DEVICE

摘要

The invention relates to a semiconductor assembly device comprising a pick and place system (7) with a bond head (8), provided with a first drive system (13) and a second drive system (14) for displacing the bond head (8) in a predetermined direction. The first drive system (13) comprises a first pivoting arm (16) and a first stationary drive (19) which serves to pivot back and forth the pivoting arm (16) within a predefined pivoting range. The second drive system (14) is mounted on the pivoting arm (16) and comprises a stationary electric motor (44).