| 摘要 |
This invention includes a method for manufacturing a semiconductor device by which implementation of a finer pitch for a semiconductor chip (10) can be handled, and the creation of voids inside an under-filling resin can be reduced in order to realize highly reliable flip-chip mounting. It involves a step in which multiple electrodes arranged two-dimensionally on one side of a semiconductor chip are connected to corresponding conductive regions on a substrate (16); a step in which an under-filling resin (20) is injected between the one surface of the semiconductor chip and the substrate; and a step in which the under-filling resin is melted at a temperature higher than its glass transition temperature while under a prescribed pressure and cured. |
