发明名称 |
CASING AND METHOD FOR MANUFACTURING SAME, AND ELECTRONIC DEVICE |
摘要 |
A casing includes a molded body provided with a recess, a conductive layer provided in the recess, and a protection film provided to cover at least a non-recessed region in a surface of the molded body provided with the recess and a surface of the conductive layer. The protection film extends generally evenly over the non-recessed region and the surface of the conductive layer. A method manufacturing the same and an electronic device including the casing are provided. |
申请公布号 |
US2009082075(A1) |
申请公布日期 |
2009.03.26 |
申请号 |
US20080211273 |
申请日期 |
2008.09.16 |
申请人 |
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发明人 |
HONDA TOMOKO;TAKAHASHI FUJIO |
分类号 |
H04M1/00;B05D5/12;H05K7/00 |
主分类号 |
H04M1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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