发明名称 |
METHOD OF MANUFACTURING ELECTRONIC COMPONENT PACKAGE |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To mass produce laminated type electronic component packages capable of high integration with accuracy and with ease. <P>SOLUTION: An electronic component package 1 has: a main body including a plurality of laminated layer parts each of which has a side surface, and having a side surface including the side surfaces of the plurality of layer parts; and a wiring 3 arranged on the side surface of the main body. Each layer part has at least one electronic component chip, and a plurality of electrodes arranged on the side surface of the layer part. This method of manufacturing the electronic component package 1 includes the steps of fabricating a main body aggregate 160 including a plurality of planned main body parts each of which is to become the main body later, the planned main body parts being arranged in one direction orthogonal to a direction of lamination of the plurality of layer parts; forming the wiring 3 for each of the planned main body parts 2P of the main body aggregate 160; and cutting the main body aggregate 160 after the formation of the wiring 3 so as to separate the plurality of planned main body parts 2P from each other so that each of them becomes the main body to form a plurality of electronic component packages. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
申请公布号 |
JP2009065111(A) |
申请公布日期 |
2009.03.26 |
申请号 |
JP20080058325 |
申请日期 |
2008.03.07 |
申请人 |
HEADWAY TECHNOLOGIES INC;SHINKA JITSUGYO KK |
发明人 |
SASAKI YOSHITAKA;SHIMIZU TATSUJI |
分类号 |
H01L25/065;H01L25/07;H01L25/18 |
主分类号 |
H01L25/065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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