发明名称 Ni PLATING BATH
摘要 PROBLEM TO BE SOLVED: To provide a nickel plating bath which is excellent in uniform electrodeposition properties and does not use boron and with which plating cost is reduced. SOLUTION: The nickel plating bath contains, as a nickel ion source, nickel chloride and/or nickel sulfate in a concentration of 1-20 g/L expressed in terms of nickel ion and citric acid in a concentration of 50-300 g/L expressed in terms of citric acid monohydrate, and is controlled to have a pH of 6.5-10 by the addition of ammonia. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009062577(A) 申请公布日期 2009.03.26
申请号 JP20070231095 申请日期 2007.09.06
申请人 TAIYO DENKA KOGYO KK 发明人 ITO TAKESHI;ITO TAKU
分类号 C25D3/12 主分类号 C25D3/12
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