| 摘要 |
A semiconductor package is provided. The semiconductor package includes: a package substrate on which a semiconductor device is mounted; a heat spreader at least bonded to a surface of the semiconductor device and having a thermal expansion coefficient value equal to or less than a thermal expansion coefficient value of the package substrate; a metal layer provided on a bonding face of the heat spreader bonded to the semiconductor device; and a solder layer formed between the metal layer and semiconductor device, and bonding the heat spreader to the semiconductor device.
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