发明名称 HIGH THERMAL CONDUCTIVITY ELECTRODE SUBSTRATE
摘要 An electrode substrate is disclosed that includes a plane and a through-plane direction. First and second carbon fibers are respectively arranged in the plane and through-plane direction. The substrate includes a thickness in the through-plane direction and the second fiber has a length less than the thickness. The first carbon fiber has a length greater than the thickness. In one example method of manufacturing the example substrate, PAN-based carbon fibers are blended with meso-phase pitch-based carbon fibers. A resin is applied to a non-woven felt constructed from the carbon fibers. The felt and resin are heated to a desired temperature to achieve a desired through-plane thermal conductivity.
申请公布号 WO2009038577(A1) 申请公布日期 2009.03.26
申请号 WO2007US78821 申请日期 2007.09.19
申请人 UTC POWER CORPORATION;BREAULT, RICHARD D. 发明人 BREAULT, RICHARD D.
分类号 H01M4/58;H01M4/36 主分类号 H01M4/58
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