| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a dissimilar metal bonded member having high joint strength while being provided with an intermetallic compound layer on the bonding interface, and to provide a method of bonding dissimilar metals by which the bonded member can be efficiently produced. <P>SOLUTION: A compound layer L comprising at least one kind of intermetallic compound is formed on the bonding interface between dissimilar metallic materials 1, 2, wherein the intermetallic compound layer L is formed in an area 52% or greater of an area of the bonding interface and has a thickness of 0.5 to 3.2 μm. <P>COPYRIGHT: (C)2009,JPO&INPIT |
