| 摘要 |
PROBLEM TO BE SOLVED: To provide a copolyester resin and its filmy adhesive material having high adhesion strength to both of polyesters and polyimides. SOLUTION: The copolyester resin has a number-average molecular weight of≥10,000, a melting point of 70-170°C, a melting heat of≤20 J/g, an acid value of≥0.5 mgKOH/g and a polar component ratio of the surface free energy based on the total surface free energy of <8%, and satisfies that the adhesion strength measured by inserting a filmy adhesive material composed of the copolyester and having a thickness of≥12μm between a pair of polyimide films, hot-pressing at a temperature (the melting point of the copolyester plus 30°C) under a pressure of 20 kg/cm<SP>2</SP>for 30 min and aging at 80°C for≥15 hr is≥15 N/25 mm. The invention further provides a copolyester film adhesive material composed of the copolyester resin. COPYRIGHT: (C)2009,JPO&INPIT
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