发明名称 |
Method and system for memory thermal load sharing using memory on die termination |
摘要 |
Memory component temperature information is used to implement a method for ODT (on die termination) thermal load management. A respective temperature of a plurality of memory components are accessed, and based on this temperature, an ODT cycle is directed to a first of the memory components to avoid imposing a thermal load from the ODT cycle on a second of the memory components.
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申请公布号 |
US2009083506(A1) |
申请公布日期 |
2009.03.26 |
申请号 |
US20070005968 |
申请日期 |
2007.12.28 |
申请人 |
REED DAVID G;SIMERAL BRAD W;SURGUTCHIK ROMAN;TITUS JOSHUA |
发明人 |
REED DAVID G.;SIMERAL BRAD W.;SURGUTCHIK ROMAN;TITUS JOSHUA |
分类号 |
G06F12/16;G11C99/00 |
主分类号 |
G06F12/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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