SYSTEMS AND METHODS FOR IN SITU ANNEALING OF ELECTRO- AND ELECTROLESS PLATINGS DURING DEPOSITION

摘要

Systems and methods for in-situ annealing of metal layers as they are being plated on a substrate by action of a chemical solution are provided. The in-situ annealing, in conjunction with controlled slow growth rates, allows control of the structure of the plated metal layers. The systems and methods are used for maskless plating of the substrates.