| 摘要 |
Provided herein are a phenolic hydroxyl group-containing aromatic polyamide resin and a resin composition containing the resin, such as an epoxy resin composition containing an epoxy resin. The phenolic hydroxyl group-containing aromatic polyamide resin has a structure represented by the following formula (1): wherein m and n are average values satisfying the following formula: 0.005<=n/(m+n)<0.05, m+n is a positive value of 2 to 200, Ar1 is a bivalent aromatic group, Ar2 is a phenolic hydroxyl group-containing bivalent aromatic group, and Ar3 is a bivalent aromatic group. Such a phenolic hydroxyl group-containing aromatic polyamide resin has a low ionic impurity content and improved adhesive properties as well as excellent properties inherent in conventional phenolic hydroxyl group-containing aromatic polyamide resins, such as the ability to allow a cured epoxy resin composition to have excellent flexibility, electrical properties, flame retardancy, and the like.
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