发明名称 BACKPLANE STRUCTURES FOR SOLUTION PROCESSED ELECTRONIC DEVICES
摘要 There is provided a backplane for an organic electronic device. The backplane has a TFT substrate; a multiplicity of electrode structures; and a bank structure defining a multiplicity of pixel openings on the electrode structures. The bank structure has a height adjacent to the pixel opening, hA, and a height removed from the pixel opening, hR, and hA is significantly less than hR.
申请公布号 US2009078941(A1) 申请公布日期 2009.03.26
申请号 US20080237487 申请日期 2008.09.25
申请人 TSAI YAW-MING A;STAINER MATTHEW 发明人 TSAI YAW-MING A.;STAINER MATTHEW
分类号 H01L27/14;H01L21/00;H01L21/311 主分类号 H01L27/14
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