发明名称 |
BACKPLANE STRUCTURES FOR SOLUTION PROCESSED ELECTRONIC DEVICES |
摘要 |
There is provided a backplane for an organic electronic device. The backplane has a TFT substrate; a multiplicity of electrode structures; and a bank structure defining a multiplicity of pixel openings on the electrode structures. The bank structure has a height adjacent to the pixel opening, hA, and a height removed from the pixel opening, hR, and hA is significantly less than hR.
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申请公布号 |
US2009078941(A1) |
申请公布日期 |
2009.03.26 |
申请号 |
US20080237487 |
申请日期 |
2008.09.25 |
申请人 |
TSAI YAW-MING A;STAINER MATTHEW |
发明人 |
TSAI YAW-MING A.;STAINER MATTHEW |
分类号 |
H01L27/14;H01L21/00;H01L21/311 |
主分类号 |
H01L27/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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