| 摘要 |
PROBLEM TO BE SOLVED: To provide the method of peeling a protection sheet off for easily peeling the protection sheet off at an interface between a semiconductor wafer and the protection sheet without peeling the protection sheet off at an interface between the semiconductor wafer and the die-bonding film or an interface between the die-bonding film and a nonadhesive film when peeling the protection sheet off of the semiconductor wafer. SOLUTION: There is provided the method of peeling a protection sheet 1 off of a surface 2a of a semiconductor wafer 2 in a laminate 11 in which the protection sheet 1, the semiconductor wafer 2, a die-bonding film 3, and a nonadhesive film 4 are laminated in this order. In the method, the die-bonding film 3 is a film which increases its adhesion when the film is heated to 40-100°C. The laminate 11 is heated to 40-100°C so that peeling intensity of the die-bonding film 3 and the nonadhesive film 4 is set to 8 N/m or more, and the protection sheet 1 is peeled off of the surface 2a of the semiconductor wafer 2. COPYRIGHT: (C)2009,JPO&INPIT |
