Semiconductor device having decoupling capacitor formed on substrate where semiconductor chip is mounted

摘要

A semiconductor device includes a substrate having a first surface and a second surface opposing to the first surface, a semiconductor chip mounted on the first surface of the substrate, a first pad formed on the first surface of the substrate to electrically connect to a first terminal of the semiconductor chip, a second pad formed on the second surface of the substrate to electrically connect to a second terminal of the semiconductor chip, and a decoupling capacitor formed on the first surface and including the first and second pads serving as electrodes of the decoupling capacitor.