发明名称 |
Bonding Maschine um Transponder zu befestigen und Verfahren |
摘要 |
A method and apparatus for bonding integrated circuits uniquely suited to high volume tag production is described, where conductive material of a substrate at the die-attach-area is cut before an IC chip or transponder is placed on the conductive material over the cut and bonded. The apparatus performs the method of placing a first chip on a substrate having a conductive layer, measuring the location of the first chip on the substrate, cutting the conductive layer at a location of an expected subsequently placed chip to form a cut based on the measured location of the first chip, and placing the subsequently placed chip on the substrate over the cut. |
申请公布号 |
DE602005012742(D1) |
申请公布日期 |
2009.03.26 |
申请号 |
DE20056012742T |
申请日期 |
2005.06.24 |
申请人 |
CHECKPOINT SYSTEMS INC. |
发明人 |
ECKSTEIN, ERIC;CLARE, THOMAS;COTE, ANDRE |
分类号 |
H01L21/00;B21D39/00;B23K20/00;B23K31/02;B23K37/00;G06K19/077;H01L21/66 |
主分类号 |
H01L21/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|