| 摘要 |
A mount for a semiconductor device includes a carrier (20), at least two metal leads (22, 24) disposed on a bottom surface of the carrier, and a cavity (26) extending through a thickness of the carrier to expose a portion of the top surfaces of the metal leads. A semiconductor light emitting device (28, 30) is positioned in the cavity and is electrically and physically connected to the metal leads. The carrier may be, for example, silicon, and the leads may be multilayer structures, for example a thin gold layer connected to a thick copper layer. |
