摘要 |
<p>An apparatus and method for manufacturing a micro-electrical mechanical system (MEMS) package comprising a first molded body having a first acoustic port, a second molded body connected to the first molded body, a leadframe at least partially integral with at least one of the first and second molded bodies, a die cavity provided on at least one of the first and second molded bodies and having a second acoustic port, a MEMS die provided on the die cavity, a channel connecting the first and second acoustic ports, the first molded body sealing at least a portion of the channel, and a lid attached to the second molded body and sealing at least a portion of the die cavity.</p> |
申请人 |
AKUSTICA, INC.;LY, TOAN, K.;GOODELLE, JASON, P. |
发明人 |
LY, TOAN, K.;GOODELLE, JASON, P. |