发明名称
摘要 Disclosed is a semiconductor silicon wafer having an electric power supply affixed to the backside of the wafer. By fabricating the electric power supply onto the backside of the wafer that has been left unused, the semiconductor chip can have a self-supplied power, realizing the self-powered semiconductor chip with an increased efficiency. Further, since the electric power supply is installed on the wafer, not the semiconductor chip, the fabrication procedure becomes very simple, and the battery can be mounted on any type of chip.
申请公布号 JP2009513025(A) 申请公布日期 2009.03.26
申请号 JP20080537586 申请日期 2006.10.13
申请人 发明人
分类号 H01L21/02 主分类号 H01L21/02
代理机构 代理人
主权项
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