| 摘要 |
PROBLEM TO BE SOLVED: To provide a wire saw device which increase the ratio of an abrasive grain amount bonded to a wire with respect to a slurry feeding amount. SOLUTION: The wire saw device is provided with a slurry recovering and re-feeding mechanism 50 for recovering slurry 40 bonded to a wire array 20 and re-feeding the slurry to the wire array 20, at a location that is on one side of a slurry 40 feeding nozzle 41a away from an ingot 4. By this way, the slurry 40 which has been conventionally only recovered into a slurry tank can be re-fed before recovery into the slurry tank. Therefore even if the amount of the slurry 40 fed from the feeding nozzle 41a is constant, the amount of the slurry 40 fed to the wire array 20 is increased, which leads to increase in diamond abrasive grains bonded to the wire array 20, to thereby improve the sharpness of the wire 2. COPYRIGHT: (C)2009,JPO&INPIT |
