| 摘要 |
PROBLEM TO BE SOLVED: To effectively use a processing device for a semiconductor wafer for grinding a tabular article different in shape from the semiconductor wafer. SOLUTION: The tray 1 on which a plurality of rectangular works W are set is sucked to and held on the chuck table 20 of a grinding device 10, and the work W is ground by grinding units 30A, 30B. The tray 1 has a frame 2 with a same outline as the outline of the semiconductor wafer which is formed around a suction base part 3 of a porous material so formed as to match the work W. The chuck table 20 has a first suction area 21 corresponding to the suction base part 3 and a second suction area 22 corresponding to the frame 2. The work W is held on the chuck table 20 through the tray 1 with the suction base part 3 corresponding to the suction area 21 and the frame corresponding to the second suction area 22. COPYRIGHT: (C)2009,JPO&INPIT
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