| 摘要 |
PROBLEM TO BE SOLVED: To obtain a thermal head which prevents a sealing resin from leaking onto a heat sink and avoids the risk of failures of wire appearance and wire disconnection in the thermal head wherein a head substrate and a printed circuit board are arranged and bonded to be fixed on the heat sink, and a wire bonding part connecting a plurality of discrete electrodes of the head substrate with a plurality of driving elements of the printed circuit board is sealed by the sealing resin, and to obtain its manufacturing method. SOLUTION: In the thermal head and its manufacturing method, after widths in the longitudinal direction of the head substrate and the printed circuit board are set narrower than a width in the same direction of the heat sink, at least an adhesive for the head substrate among the adhesive for the head substrate for bonding fixing the head substrate on the heat sink and an adhesive for the printed circuit board for bonding fixing the printed circuit board on the heat sink is exposed on the heat sink at both ends in the longitudinal direction of a boundary part between the head substrate and the printed circuit board. Both end parts in the longitudinal direction of the sealing resin are positioned on and at least inside the exposed adhesive for the head substrate. COPYRIGHT: (C)2009,JPO&INPIT
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