发明名称 PHOTOSENSITIVE COMPOSITION, PATTERN-FORMING METHOD USING THE PHOTOSENSITIVE COMPOSITION, AND COMPOUND USED IN THE PHOTOSENSITIVE COMPOSITION
摘要 Disclosed is a photosensitive composition which enables to obtain good pattern shape and line-edge roughness in normal exposure (dry exposure), liquid immersion exposure and double exposure. Also disclosed are a pattern-forming method using such a photosensitive composition and a compound used in such a photosensitive composition. Specifically disclosed is a photosensitive composition characterized by containing a resin (A) containing a repeating unit corresponding to a compound represented by the general formula (I) below, which resin produces an acid group when irradiated with active ray or radiation. In the general formula (I), Z represents a group from which a cation is removed upon irradiation of active ray or radiation, thereby forming an acid group; A represents an alkylene group; X represents a single bond or a divalent linking group having a heteroatom; B represents a single bond, an oxygen atom or -N(Rx)-, and Rx represents a hydrogen atom or a monovalent organic group; R represents a monovalent organic group substituted by Y, and Y represents a polymerizable group. When B is -N(Rx)-, R and Rx may combine together to form a ring.
申请公布号 WO2009038148(A1) 申请公布日期 2009.03.26
申请号 WO2008JP66887 申请日期 2008.09.18
申请人 FUJIFILM CORPORATION;WADA, KENJI 发明人 WADA, KENJI
分类号 C08F20/10;G03F7/004;G03F7/039;G03F7/11 主分类号 C08F20/10
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