发明名称 FLAME-RETARDANT POLYAMIDE COMPOSITION
摘要 <p>Disclosed is a flame-retardant polyamide composition which has excellent mechanical properties such as toughness, excellent heat resistance and fluidity during reflow soldering, and good thermal stability during molding, without using a halogen flame-retardant. This flame-retardant polyamide composition exhibits stable flame retardance particularly when a thin article is molded. Specifically disclosed is a flame-retardant polyamide composition containing 20-80% by mass of a specific polyamide resin (A), 10-20% by mass of a phosphinate (B), and 0.05-10% by mass of a specific flame retardant assistant (C).</p>
申请公布号 WO2009037858(A1) 申请公布日期 2009.03.26
申请号 WO2008JP02599 申请日期 2008.09.19
申请人 MITSUI CHEMICALS, INC.;SEKI, MASASHI 发明人 SEKI, MASASHI
分类号 C08L77/00;C08K3/22;C08K5/5313;C08K7/02 主分类号 C08L77/00
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