发明名称 Cu-Zn-Sn BASED COPPER ALLOY SHEET MATERIAL, METHOD FOR PRODUCING THE SAME, AND CONNECTOR
摘要 PROBLEM TO BE SOLVED: To provide a Cu-Zn-Sn based copper alloy sheet material having reduced Young's modulus, in which bending workability, stress relaxation resistance and stress corrosion cracking resistance, or further, high strength properties are simultaneously improved to high levels. SOLUTION: Disclosed is a copper alloy sheet material having a composition comprising, by mass, 10 to 37% Zn and 0.1 to 4% Sn, and, when necessary, further comprising one or more kinds selected from≤2% Ni,≤2% Fe and≤1% Si, or further comprising one or more kinds selected from Co, Cr, Mg, Al, B, P, Zr, Ti, Mn and V in the range of≤3% in total, and the balance Cu with inevitable impurities, and crystal orientation satisfying Iä420}/I<SB>0</SB>ä420}>0.8; wherein, Iä420} denotes the X-ray diffraction intensity of the ä420} crystal face in the sheet face of the copper alloy sheet material; and I<SB>0</SB>ä420} denotes the X-ray diffraction intensity of the ä420} crystal face in pure copper standard powder. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009062610(A) 申请公布日期 2009.03.26
申请号 JP20070326589 申请日期 2007.12.18
申请人 DOWA METALTECH KK 发明人 KO IRIN;SUDA HISASHI;NARUEDA HIROTO;SUGAWARA AKIRA
分类号 C22C9/04;C22F1/00;C22F1/08;H01B1/02;H01B13/00;H01L23/50 主分类号 C22C9/04
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