| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a densely-integrated highly functional electronic apparatus capable of increasing the productivity with reduced constraint in designing IC chips and packages and facilitating general versatility. SOLUTION: The present invention relates to a method of manufacturing an electronic apparatus comprising a process for forming an adhesive material layer 5 on a child chip so as to cover all the faces of an electrode forming surface of the child chip, that is, a second electronic apparatus mounted on a first electronic apparatus, that is, a parent chip 2 having metallic bump electrodes or Au stud bumps 1 and provided with an electrode connected to the Au stud bumps 1 of the parent chip; and a process of mounting the child chip 3 on the parent chip 2. In the process of mounting the child chip 3 on the parent chip 2, the Au stud bumps 1 of the parent chip 2 are electrically connected to the electrodes on the child chip 3 through the adhesive layer 5 and the space between the parent chip 2 and the child chip 3 is sealed with the adhesive layer 5. COPYRIGHT: (C)2009,JPO&INPIT
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