| 摘要 |
The present invention provides methods for singulating microelectromechanical systems (MEMS) die from a wafer. A plurality of MEMS devices are formed on the top surface of a wafer, and a plurality of intersecting scribe lanes are then formed, on the bottom surface of the wafer, to define a plurality of dies, each including at least one MEMS device. The intersecting scribe lanes penetrate the wafer to a depth of about 80%, and the wafer is cleaved along the scribe lanes to separate each of the plurality of dies from the wafer.
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