METHOD OF SEGMENTING SEMICONDUCTOR WAFER

摘要

A method of segmenting a semiconductor wafer, which is capable of preventing chippings, is provided. A semiconductor wafer 1 is partitioned into a circumferential ring-shaped region Ia and a segmentation region placed in the inner side of the ring-shaped region Ia. The semiconductor wafer 1 included in the segmentation region is cut into the form of a lattice along a plurality of perpendicular cutting lines 4 and is segmented into a plurality of chips 2. On the other hand, the semiconductor wafer 1 included in the ring-shaped region Ia is cut along two partition lines 5 extending in parallel to the cutting lines 4 from the center 0 of the semiconductor wafer 1 and is partitioned into four independent regions.