发明名称 METHODS FOR PROVIDING COMPOSITE ASPERITIES
摘要 <p>Novel methods for providing asperities (sometimes referred to as asperates) on interposer contacts. The asperities comprise low electrical resistant particles such as titanium carbide that are bonded or plated in conjunction with nickel or other matrices on metallic substrate pads. An electroplating bath that has the low electrical resistant particles dispersed in solution is used at low current densities to electrolytically plate a composite electrically low resistant abrasive surface. The composite bond between the particles and the substrate can then be further reinforced with a standard metallic electroplate, if desired.</p>
申请公布号 WO2009039271(A1) 申请公布日期 2009.03.26
申请号 WO2008US76849 申请日期 2008.09.18
申请人 ANESTEL CORPORATION;MCMULLIN, FARIS, W.;CAMP, JAMES, VAN 发明人 MCMULLIN, FARIS, W.;CAMP, JAMES, VAN
分类号 H05B33/10 主分类号 H05B33/10
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