SOLID PRINTED WIRING BOARD, METHOD FOR MANUFACTURING SOLID PRINTED WIRING BOARD, AND ELECTRONIC COMPONENT MODULE

摘要

A solid printed wiring board (13) is provided with a first printed wiring board (22) having an opening section (18), and a second printed wiring board (26), which is fixed to the first printed wiring board (22), below the opening section (18), through a bonding layer (17) having a conductive paste section (19). A large-height electronic component (11b) is arranged on a second wiring section (14b) on the second printed wiring board (26) in the opening section (18). Thus, a mounting component is reduced in height by making the height equivalent to that of a small-height electronic component (11a) arranged on a first wiring section (14a) of the first printed wiring board (22).