发明名称 AL-NI-B ALLOY SPUTTERING TARGET
摘要 Provided is an Al-Ni alloy sputtering target by which generation of arcing during sputtering is suppressed. The Al-Ni-B alloy sputtering target contains Ni and B, and has Al3Ni compound deposited. The ratio of the Al3Ni compound containing B-containing particles to the total deposition quantity of the Al3Ni compound is 2% or more, and the average particle diameter of the Al3Ni compound is 20mum or less.
申请公布号 KR20090031500(A) 申请公布日期 2009.03.26
申请号 KR20087026735 申请日期 2008.10.31
申请人 MITSUI MINING & SMELTING CO., LTD. 发明人 MATSUZAKI KENJI
分类号 C23C14/34;C22C21/00 主分类号 C23C14/34
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