| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a holding pad which improves the flatness of a polished workpiece. <P>SOLUTION: The holding pad 1 has a polyurethane sheet 2. The holding pad 1 has a template 8 stuck to a holding surface P thereof, for inhibiting a silicone wafer from jumping out of a wafer holder due to side skid during polishing work, and a substrate 6 on a surface opposite to the holding surface P. The polyurethane sheet 2 has rounded foam pieces 3 formed therein along a thickness direction thereof, in an almost uniformly dispersed manner. The foam pieces are produced by wet film formation. The polyurethane sheet 2 has the holding surface P subjected to slicing finishing, and the thickness fluctuation ratio thereof is set to 5% or less. The part of the foam pieces 3 are opened in the holding surface P, and openings 4 of the foam pieces are almost uniformly distributed, to thereby adjust adsorbing force and frictional force working on the silicone wafer in a well-balanced manner. <P>COPYRIGHT: (C)2009,JPO&INPIT |
