| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve reliability of a semiconductor device composed by stacking a plurality of semiconductor chips on a wiring board. <P>SOLUTION: After the semiconductor chips 3, 4, 5, 6 are stacked and mounted on the wiring board 21 through die attaching films 11a, 11b, 11c, 11d, respectively, the semiconductor chips 3, 4, 5, 6 are wire-bonded to the wiring board. Then, by executing a resin sealing process, a sealing resin 9b containing a filler is formed on the wiring board 21 to cover the semiconductor chips 3, 4, 5, 6 and bonding wires 8. After a die bonding and wire bonding process, the thicknesses of the respective die attaching films 11b, 11c, 11d at a stage before the resin sealing process are set larger than the average particle diameter of the filler included in the sealing resin 9b. <P>COPYRIGHT: (C)2009,JPO&INPIT |
