| 摘要 |
PROBLEM TO BE SOLVED: To provide a miniaturized and thin electronic component package structure in which a function element is sealed in a hollow state and which can be produced also by a transfer molding method of resin sealing. SOLUTION: An electronic component package is composed of a substrate where an element having a function area and electrodes is formed on its surface, resin layers arranged over the function areas of the substrate via space, a metallic layer covering the space, and insulating resin layers formed on positions of the metallic layer which respectively correspond to the resin layers, and its structure has a feature that the elastic modulus of the resin layer is larger than that of the insulating resin layer. COPYRIGHT: (C)2009,JPO&INPIT
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