| 摘要 |
PROBLEM TO BE SOLVED: To efficiently insert a chip type electronic component, such as a multilayer ceramic capacitor, into a through hole of a holding pallet used when an external electrode of the chip type electronic component is formed. SOLUTION: A guide plate 11 having a guide hole 5 for guiding the chip type electronic component 3 into a storage hole 6 is placed as an array plate 1 on a storage plate 10 used as the holding pallet. The guide hole 5 includes: a first guide portion 8 inclined to a top surface 2 of the array plate 1 at right angles or an obtuse angle; and a second guide portion 7 inclined at an acute angle facing each other, and the chip type electronic component 3 is slid from the second guide portion 7 in the direction of the first guide portion 8 to be arrayed in the storage hole 6. COPYRIGHT: (C)2009,JPO&INPIT
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