| 摘要 |
A semiconductor device and manufacturing method thereof are provided to prevent the paste from being flowed out the rear side of sealer from the chip loading part by forming the step part lower than the chip mounting face in the peripheral part. The Ag paste(6) is arranged on the supporting surface of a chip(1c) of the tap(1b). The semiconductor chip is mounted on the tap through the Ag paste. The pad(2a) of the semiconductor chip and the lead(1a) of the tap are electrically connected with a plurality of wires(4). The semiconductor chip and the plurality of wires are sealed by the sealer(3). The step part(1e) is formed in the peripheral part of the supporting surface of a chip of the tap. The step part is lower than that of the supporting surface of a chip. Therefore, the Ag paste stays within the step part. |
