| 摘要 |
<p>A tape substrate and semiconductor module for smart card, method of fabricating the same, and smart card are provided to manufacture the tape substrate by using the metal material instead of the organic material and to realize the reduction of manufacturing processes. The tape substrate for the smart card comprises one or more tape unit. Each tape unit comprises the chip mounting part(60), a plurality of pin electrode cattails(50), and the edge part(70) and the cutting part(55). A plurality of pin electrodes is placed around the chip mounting part. The edge part surrounds the chip mounting part and a plurality of pin electrode part. And the cutting part is positioned between the chip mounting part and edge part and between a plurality of pin electrode parts and the edge part.</p> |
