| 摘要 |
Fluororubber composition for encapsulating semiconductor parts is provided to improve the fire retardant characteristic by using the adequate rate fluorine rubber of Al(OH)3 for sealing. The fluorine rubber comprises the raw material 40~ 90 weight% of the fluorine rubber, the filler 5 ~ 50 weight%, and triallyl isocyanurate(Taic) 2 ~ 5 weight% and vulcanizing agent 3 ~ 10 weight%. The vulcanizing agent is formed to the mixture selected from the different compound including the cyclohexanone peroxide, T-butylperoxyisopropylcarbonate, T- butylperoxy laurylate, T- butylperoxyacetate, di -t- butyldiperoxy phthalate, T- dibutylperoxymaleic acid, T-butylcumylperoxide, T-butyl hydroperoxide, dibenzoyl peroxide, dicumylperoxide, 1,3- bis (T- butylperoxyisopropyl) benzene, methylethylketone perpoxide, di - (2,4- Dichlorobenzoyl) peroxide, 1,1- di (T- butylperoxy) -3,3,5- trimethylcyclohexane, 2,5- dimethyl -2,5- di (benzoylperoxy) hexane, 2,5- dimethyl -2,5- di hexane, di-T-butyl peroxide more than the first class or 2 kind.
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