| 发明名称 |
CONDUCTIVE PARTICLE, ADHESIVE COMPOSITION, CIRCUIT-CONNECTING MATERIAL, CIRCUIT-CONNECTING STRUCTURE, AND METHOD FOR CONNECTION OF CIRCUIT MEMBER |
| 摘要 |
<p>The conductive particle of the invention each comprises a conductive nucleus particle and an insulating coating containing an organic high molecular compound on the surface of the nucleus particle, and the coverage factor as defined by the following formula (1) is in the range of 20-40%.</p> |
| 申请公布号 |
EP2040268(A1) |
申请公布日期 |
2009.03.25 |
| 申请号 |
EP20070741414 |
申请日期 |
2007.04.11 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
TANAKA, MASARU;TAKETATSU, JUN |
| 分类号 |
H01B5/00;C09J9/02;C09J11/00;C09J201/00;H01B1/22;H05K3/32 |
主分类号 |
H01B5/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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