| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor sensor which is capable of restraining a defective semiconductor sensor chip lacking in characteristics from occurring. SOLUTION: The semiconductor sensor 100 is equipped with a package member 10, an IC chip 30, a semiconductor sensor chip 50, and a lid 70, etc. The IC chip 30 is mounted on a chip mount on the bottom inside the package member 10 through the intermediary of an adhesive film 20. The semiconductor sensor chip 50 is mounted on the IC chip 30 through the intermediary of an adhesive film 40. The package member 10 is electrically connected to the IC chip 30 with a wire 60a, and the IC chip 30 is electrically connected to the semiconductor sensor chip 50 with a wire 60b. The lid 70 is equipped with a partitioning member 90 which surrounds the beam structure 51 of the semiconductor sensor chip 50 and joined to the connecting member 80 of the package member 10 by welding. COPYRIGHT: (C)2006,JPO&NCIPI |
