METHOD OF PROCESSING A SUBSTRATE, SPIN UNIT AND APPARATUS OF PROCESSING A SUBSTRATE HAVING THE SAME

摘要

A method of processing a substrate is provided to perform etching of the bottom of the substrate by injecting a solution and a cleaning solution from the bottom of the substrate. A method of processing s substrate is comprised of the steps: supporting the substrate(S100); rotating the substrate(S200) to rotate the supported substrate one direction(S300); performing an injection process in order to selectively spray one of the solution and the cleaning solution on the lower surface of the rotating substrate; selectively injecting one of the solution and the cleaning solution which are used for the injection process of the bottom of the substrate.